Integrating Feedback Control and Run-to-Run Control in Multi-Wafer Thermal Atomic Layer Deposition of Thin Films

Run by Run Advanced Process Control of Metal Sputter Deposition

Metal sputter deposition processes for semiconductor manufacturing are characterized by a decrease in deposition rate from run to run as the sputter target degrades. The goal is to maintain a desired deposition thickness from wafer to wafer and lot to lot. Run by run (RbR) model-based process control (MBPC) has been applied to metal sputter deposition processes at Texas Instruments. RbR MBPC, b...

Run-to-Run Control in Semiconductor Manufacturing

Atomic layer deposition and properties of ZrO2/Fe2O3 thin films

Thin solid films consisting of ZrO2 and Fe2O3 were grown by atomic layer deposition (ALD) at 400 °C. Metastable phases of ZrO2 were stabilized by Fe2O3 doping. The number of alternating ZrO2 and Fe2O3 deposition cycles were varied in order to achieve films with different cation ratios. The influence of annealing on the composition and structure of the thin films was investigated. Additionally, ...

Run-to-run Optimization via Constraint Control

Run-to-run optimization methodologies exploit the repetitive nature of batch processes to find the optimal operating policy in the presence of uncertainty. For the class of batch optimization problems where the solution is determined by terminal constraints, the update of the decision variables towards their optimal values is realized using a constraint control scheme. The methodology is adapte...

Atomic Layer Deposition of Noble Metal Thin Films

3 Preface 4 List of publications 5 List of symbols and abbreviations 6